Hello, everyone! This mall to adjust some of the tools product the price, this time bring you first the solder ball products.
BGA/CSP packaging a complied with the trend of the development of the technology and the development of satisfied people short of electronic products, small, light, thin, this is a kind of high density surface mounting packaging technology, the BGA rework stations, BGA encapsulation, BGA rework, BGA balls are very demanding. At the bottom of the packaging, pins, globular and arranged in a pattern similar to the grid, which named the BGA. Product features: (tin) the purity and sphericity (lead-free solder ball) are very high, suitable for BGA, CSP and other advanced packaging technology and fine welding, solder ball minimum diameter is 0.14 mm, for the standard size can be customized according to customer’s requirements. When used with automatic correction ability and can allow a relatively large placed error, endless surface flatness problem.
    Our main sales of the specifications of the first 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm and 0.35 mm,0.4mm ,045mm,0.5mm
0.55mm,0.6mm,0.65mm,0.75/0.76 mm, 0.65 mm, 0.889 mm. Full bottles of 250 k, native to Taiwan high-quality tin beads, various specifications are lead and lead two kinds, can accept other size number of orders, very suitable for friends and business procurement related electronic maintenance aspects.
    Echocardiography action, more products, more surprise waiting for you in the shi mall!
This article from OS-STORE.
